Recrystallization Behavior of ECAE Processed OFHC Copper

Effect of strain rate on deformation texture in OFHC copper

A strong strain rate dependence on the crystallographic texture of oxygen-free high conductivity copper is observed and reported for the first time. Two shear compression specimens were deformed at widely different strain rates (0.001 s 1 and 7000 s ) to the same strain, and their textures were determined using orientation image microscopy. By comparing the stress–strain curves and the major te...

New Dynamic Constitutive Model for OFHC Copper Film

The material properties of OFHC copper film was investigated with the High-Speed Material Micro Testing Machine (HSMMTM) at the high strain rates. The rate-dependent stress-strain curves from the experiment and the Johnson−Cook curve fitting showed large discrepancies as the plastic strain increases since the constitutive model implies no rate-dependent strain hardening effect. A new constituti...

Recrystallization Behavior of Commercial Purity Aluminium Alloys

The recrystallization of copper single crystals deformed at 4.2 K

The deformation of copper single crystals at 4.2 K occurs by a sequence of slip, twinning and slip in the twinned structure. Subsequent annealing of the deformed structures obtained at various points at this sequence of deformation permits the detailed nature of the deformed and recrystallized states to be related in a unique fashion. Material recrystallized from structures obtained prior to th...

Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire

Tough pitch copper wire (99.97% Cu) is generally characterized by the spiral elongation number. The principle of the test is based on the influence of impurities on the recrystallization kinetics. Alternative non-metallographic techniques to characterize the recrystallization kinetics have been investigated in this study, such as differential scanning calorimetry (D.S.C.) and residual electrica...